Hydra-MT-PRO-063 T3-T6 - Sn63Pb37 leaded high activity water-soluble eutectic solder paste (REM1) F but also not too thick

but also not too thick - easy to clean

Used for attachment of temperature-sensitive components to printed circuit boards

V3 - is universal for leaded and lead-free

Alloy Tin / Copper / Nickel / Germanium (Sn/Cu/Ni+Ge) Melting Point 227°C (441°F) Flux Core NC-Core (ROL0) — No-Clean

Harsh Environments: Optimized for Down-hole

Hydra-MT-PRO-063 T3-T6 - Sn63Pb37 leaded high activity water-soluble eutectic solder paste (REM1) F but also not too thickHydra PRO Mt Sn63Pb37 high activity REM1 water soluble leaded solder paste for OEM manufacturers requiring instant no fail wetting action and soldering assurance with minimum residue and easy cleaning. DI water soluble minimum cost and regulatory burden. World's first Water Soluble (WS) solder paste with QC Aid optical tracer glowing in UV enabling for optional instant visual contamination inspection without complex equipment environment or excessive