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MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V tin planting

MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V tin planting

Name: MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V tin planting
Brand: dianalocatelli.com
SKU: 52182522566
Price: 96.86 USD
Availability: InStock
Rating: 4.3573 (30 reviews)

SKU: 52182522566

4.4

EUR96.86 EUR120.86

Pay in 4 interest-free payments of $24.21 Learn more

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Ships within 48 hours · Estimated delivery Aug 14 - Aug 19

Live Spec

MECHANIC HEAT AIR Intelligent Preheating Platform For iPhone X-16 PRO MAX Motherboard Layered Chip BGA Stencil/Dot Matrix Repair Voltage::110V tin plantingDescription Mechanic Heat Air constant temperature desoldering preheating platform for iPhone X 11 12 13 14 15 16 Pro Max motherboard layering bonding repair. Intelligent Mechanic Heat Air desoldering station for mobile phone motherboard layered, degumming, tin planting, lamination, delamination, reflow welding, desoldering, and soldering repair. Packing list(standard): Host + Common module + power cord + box. Packing list(X 16 PM): Standard kit +

Store: dianalocatelli.com · Domain: dianalocatelli.com

Description

tin planting

Support soldering handle: T210

and USB-A charging protocol output

control the speed at any time

* High-temperature synthetic stone

Exchange/Return Notes